Relying on over 30 years wire bonding knowhow, TPT designs and manufactures a complete range of manual and semi automatic wire bonder machines. TPT is a privately owned company, with the goal to provide the highest quality wire bonding equipment.

Based in Munich, TPT draws strength from Germany's high technology region. TPT bonders are used in many leading Universities, Institutes and Semiconductor, Aerospace & Medical device companies throughout the world.

Model HB16

TPTThe Model HB16 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines.

One bond head for bonding in Ball/Wedge or Wedge/Wedge bonding mode . Only tool change necessary.

Easy operation with TFT Touch Screen and direct access and simple adjustment of all bond parameters.

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