Principal - MicroAssembly Technolgies

MicroAssembly Technologies, Ltd. (MAT), founded in January 2000, specializes in providing proven solutions to the die attach industry. MAT is a dynamic team of engineers and applications specialists with many years of experience in the field of equipment for die attach.

Our specific strengths are with complex, high value applications such as Multi Chip Modules, Imaging devices, Sensors, MEMS devices, Flip Chip. Our machines perform Adhesive based and/or Eutectic processes.

Our main products are the High Accuracy Model 6400 Die Attach System and Model 6410 Automatic Dispensing System.

MicroAssmebly TechnologiesModel 6400

Flexible, fully automatic die attach is controlled by user friendly Windows XP® based software. The Model 6400 performs cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies.

It is available either installed on its own bench or in "Table-Top" configuration (without bench). It has a very high placement accuracy of 3 microns @ 3 sigma (process dependent)that is ensured by the closed loop servo systems and the high resolution digital vision system.

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